Humburger Icon
Logo1
Login & Sign up
Bookswagon-24x7 online bookstore
AddBanner
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
Bookswagon icon Categories
Close

Refine your Search

By Price

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
5 results found
List viewGrid view
Sort By:
1.
Backdoor Attacks against Learning-Based Algorithms37 %
Backdoor Attacks against Learning-Based Algorithms
By: Haojin Zhu, Xuemin (Sherman) Shen, Shaofeng Li, Wen Wu
Publisher: Springer International Publishing AG
No Review Yet
₹15,923
₹10,031
Binding:
Hardback
Release:
30 May 2024
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Rapid On-Site Evaluation (ROSE) in Diagnostic Interventional Pulmonology
Rapid On-Site Evaluation (ROSE) in Diagnostic Interventional Pulmonology
By: Chen Meng, Wen Li, Bo Wu, Jing Feng, Erlie Jiang
Publisher: Springer Verlag, Singapore
No Review Yet
₹9,156
Binding:
Paperback
Release:
31 May 2021
Language:
English
Available
Ships within 4-6 Days Explain..
3.
Rapid On-Site Evaluation (ROSE) in Diagnostic Interventional Pulmonology21 %
Rapid On-Site Evaluation (ROSE) in Diagnostic Interventional Pulmonology
By: Chen Meng, Wen Li, Bo Wu, Jing Feng, Erlie Jiang
Publisher: Springer Verlag, Singapore
No Review Yet
₹21,231
₹16,772
Binding:
Hardback
Release:
31 May 2020
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 9901 % NR
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
By: E. Todd Ryan, Wen-Li Wu, Qinghuang Lin, Do Yeung Yoon
Publisher: Cambridge University Press
No Review Yet
₹3,293
₹3,260
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
5.
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990NR
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
By: E. Todd Ryan, Wen-Li Wu, Qinghuang Lin, Do Yeung Yoon
Publisher: Materials Research Society
No Review Yet
₹2,564
Binding:
Hardback
Release:
12 Sep 2007
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
No more records found
ASK VIDYA