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John H. Lau

John H. Lau

31 results found
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1.
Chiplet Design and Heterogeneous Integration Packaging37 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹12,739
₹8,026
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology37 %
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹18,047
₹11,370
Binding:
Hardback
Release:
24 May 2024
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Chiplet Design and Heterogeneous Integration Packaging37 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹18,047
₹11,370
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Semiconductor Advanced Packaging37 %
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹11,677
₹7,357
Binding:
Paperback
Release:
19 May 2022
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Semiconductor Advanced Packaging37 %
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹16,985
₹10,701
Binding:
Hardback
Release:
18 May 2021
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
₹12,208
₹7,691
Binding:
Paperback
Release:
30 May 2021
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
₹16,985
₹10,701
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 12-14 Days Explain..
8.
Heterogeneous Integrations37 %
Heterogeneous Integrations
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹16,985
₹10,701
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
Ships within 12-14 Days Explain..
9.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau
Publisher: Van Nostrand Reinhold Inc.,U.S.
No Review Yet
₹21,231
₹13,376
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
Ships within 12-14 Days Explain..
10.
Handbook Of Tape Automated Bonding37 %
Handbook Of Tape Automated Bonding
By: John H. Lau
Publisher: Van Nostrand Reinhold Inc.,U.S.
No Review Yet
₹21,231
₹13,376
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
Available
Ships within 12-14 Days Explain..
11.
Chip On Board37 %
Chip On Board
By: John H. Lau
Publisher: Van Nostrand Reinhold Inc.,U.S.
No Review Yet
₹21,231
₹13,376
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
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12.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹21,231
₹13,376
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 12-14 Days Explain..
13.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹15,923
₹10,031
Binding:
Hardback
Release:
13 Apr 2018
Language:
English
Available
Ships within 12-14 Days Explain..
14.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹11,677
₹7,357
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Available
Ships within 12-14 Days Explain..
15.
Mechanics of Solder Alloy Interconnects37 %
Mechanics of Solder Alloy Interconnects
By: Darrel R. Frear, John H. Lau, Harold S. Morgan
Publisher: Van Nostrand Reinhold Inc.,U.S.
No Review Yet
₹21,231
₹13,376
Binding:
Hardback
Release:
31 Jan 1994
Language:
English
Available
Ships within 12-14 Days Explain..
16.
Chiplet Design and Heterogeneous Integration PackagingNR
Chiplet Design and Heterogeneous Integration Packaging
By: Lau John H. Lau
Publisher: Springer Nature B.V.
No Review Yet
₹4,822
Binding:
Paperback
Release:
28 Mar 2023
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
17.
CHIP SCALE PACKAGE, CSP19 % NR
CHIP SCALE PACKAGE, CSP
By: John H. Lau
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹5,599
₹4,535
Binding:
Hardback
Release:
28 Feb 1999
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
18.
Microvias: For Low Cost, High Density Interconnects21 % NR
Microvias: For Low Cost, High Density Interconnects
By: John H Lau, Ricky S W Lee
Publisher: McGraw-Hill Professional Publishing
No Review Yet
₹5,332
₹4,212
Binding:
Digital (delivered electronically)
Release:
26 Apr 2001
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
19.
Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies25 % NR
Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
By: John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹2,492
₹1,869
Binding:
Digital (delivered electronically)
Release:
29 Feb 2000
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
20.
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies13 % NR
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
By: John H. Lau
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹1,783
₹1,551
Binding:
Hardback
Release:
08 Feb 2000
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
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